TSMC Boosts Capital Budget Again, to $30B
By Alan Patterson, EETimes (April 15, 2021)
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC) has again raised its 2021 capital expenditure target to $30 billion after customer demand exceeded the company’s expectations three months ago.
The world’s biggest chip foundry, which is running full tilt with capacity utilization in the neighborhood of 100%, in January was aiming for capex this year to reach about $28 billion. The new $30 billion figure nearly doubles the $17.2 billion the company spent in 2020.
TSMC said during a conference call with analysts that it upgraded the target in order to meet increasing demand for advanced and specialty technologies in the next several years. About 80% of the budget will go to leading process technologies, including 3nm, 5nm and 7nm, with the remaining 10% earmarked for advanced packaging and mask making, and about 10% for specialty technologies.
E-mail This Article | Printer-Friendly Page |
|
Related News
- TSMC Boosts Capital Expenditure Budget on Strong Outlook
- TSMC Boosts 2016 Capex to About $9.5 Billion
- TSMC Reports First Quarter EPS of NT$8.70
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- TSMC Reports Fourth Quarter EPS of NT$9.21
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance