ARM pushes chiplets and 3D packaging for Neoverse chips
By Nick Flaherty, eeNews Europe (April 27, 2021)
ARM has launched an enhanced mesh interconnect IP for its high performance Neoverse processor cores that enables more use of chiplets and 3D packaging.
Chiplets allows separate chips to be used in the same package to provide high speed data links or stacked memory. The CMN-700 supports 144 end points for 128 cores plus chiplets and memories, rather than the limit of 64 for the previous CMN-600.
“CMN-700 [is] a key element for constructing high-performance Neoverse V1 and Neoverse N2-based SoCs,” said Chris Bergey, SVP and GM, Infrastructure Line of Business at ARM. “Platform IP is essential which is why we developed the CMN700 mesh interconnect with DDR5 support and multichip capabilities,” he said. “It adds CXL to build host or end point devices and the the other key multichip upgrade was for multi-die and chiplet integration and this will open new doors and allow more flexibility,” he said.
E-mail This Article | Printer-Friendly Page |
|
Arm Ltd Hot IP
Related News
- Google Cloud Delivers Customized Silicon Powered by Arm Neoverse for General-Purpose Compute and AI Inference Workloads
- Arm Updates CSS Designs for Hyperscalers' Custom Chips
- Faraday Collaborates in Arm Total Design to Provide Arm Neoverse CSS-based Design Services
- How the Worlds of Chiplets and Packaging Intertwine
- Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process