TSMC in "Due Diligence" on Possible Japan Fab
By Alan Patterson, EETimes (July 15, 2021)
Taiwan Semiconductor Manufacturing Co. (TSMC) is evaluating whether to build a chip facility in Japan as nations around the world are seeking the top foundry’s help to create secure electronics supply chains.
The company has established a 3D IC research center in Japan, where it has gathered more than 20 Japanese partners, TSMC said at its latest announcement of quarterly results. TSMC will be in charge of the center’s technology development for advanced packaging.
The company is also evaluating the possible start of a new chip fab in Japan, according to TSMC CEO C.C. Wei, speaking at the event.
“In Japan, we are in the due diligence process now to do that with a fab. Let me say that clearly.”
E-mail This Article | Printer-Friendly Page |
Related News
- After TSMC fab in Japan, advanced packaging facility is next
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- TSMC looks to standardise chiplet protocols in "world changing" move
- TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology
Breaking News
- Arm revenues up 47%; shares fall
- Sondrel awarded new Video Processor ASIC design and supply contract for a leading provider of High-Performance Video systems
- X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
- Softbank reported to be in talks to buy Graphcore
- VESA Elevates PC and Laptop HDR Display Performance with Updated DisplayHDR Specification
Most Popular
- Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
- Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip
- sureCore announces successful tape-out of cryogenic IP demonstrator
- Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite
- Announcing Availability of Silicon-Proven 12bit 1Msps SAR ADC IP Core for Whitebox Licensing with Royalty Free