CXL Product Pipeline Gets Flowing
By Gary Hilson, EETimes (July 16, 2021)
Micron Technology made the news when it abandoned further 3D XPoint development in favor of focusing on the rapidly emerging Compute Express Link (CXL) interconnect standard. But it’s not the first company out of the gate with CXL-related products.
Rambus is corralling its wide-ranging portfolio of intellectual property to address the burgeoning CXL market, including some from recent acquisitions, while Samsung recently announced a high-performance DRAM module.
Samsung’s Double Data Rate 5 (DDR5) DRAM-based memory module is targeted at data-intensive applications such as artificial intelligence (AI) and high-performance computing (HPC) that need server systems that can significantly scale memory capacity and bandwidth. The company has been collaborating with several data center, server, and chipset manufacturers to develop next-generation interface technology since the CXL consortium was formed in 2019.
Related News
- CXL Gets Off the Drawing Board
- CXL Gets Off the Drawing Board
- SNIA Spec Gets Data Moving in CXL Environment
- Elevate the performance of your Automotive Application by integrating the IP cores of a 14-bit wideband Time-Interleaved Pipeline Data Converters
- Xylon's logicBRICKS HDR ISP IP Suite Gets an RGB-IR Image Processing Upgrade
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |