Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Bankrupt Tsinghua Unigroup advertises for investors
By David Manners, Electronics Weekly (July 26, 2021)
Bankrupt Tsinghua Unigroup is looking for investors to bail it out. It has debts of $30.8 billion.
The website of China’s National Enterprise Bankruptcy Information Disclosure Platform is asking for investors saying that they must have $7.7 billion in minimum total assets or $3 billion in minimum net assets.
It also says: “The strategic investors should have operational capability and managerial experience in semiconductor and cloud businesses. They must be able to promote the development of our core businesses.”
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- "Insolvent" Tsinghua Unigroup Aims to Restructure
- Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources
- China's Tsinghua Secures $22 Billion in State Backing
- Intel and Tsinghua Unigroup Collaborate to Accelerate Development and Adoption of Intel-based Mobile Devices
- VSORA Secures $4.2 Million in Financing from Otium Capital, Angel Investors
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation