Flex Logix to speak at the 2021 AI Hardware Summit on Optimizing AI Inference Performance
MOUNTAIN VIEW, Calif. – September 8, 2021 – Flex Logix Technologies, Inc., supplier of fast and efficient Edge AI inference accelerators and the leading supplier of eFPGA IP, announced today that Cheng Wang, its Co-Founder and Senior VP of Technology and Software, will be presenting at next week’s AI Hardware Summit in Mountain View California on ways to optimize AI inference performance through reconfigurable hardware and software. Following the presentation and throughout the show, Flex Logix will also be showing demonstrations at its exhibitor table on how its InferX accelerator is delivering leadership performance per watt, which is critical in edge inference applications.
https://aihardwaresummit.com/events/ai-hardware-summit
Presentation title: Best of Both Worlds: An Efficient, Reconfigurable Solution for Inference Acceleration
When: Wednesday, September 15th
Time: 10:30 am PT
About Flex Logix
Flex Logix is a reconfigurable computing company providing AI inference and eFPGA solutions based on software, systems and silicon. Its InferX X1 is the industry’s most-efficient AI edge inference accelerator that will bring AI to the masses in high-volume applications by providing much higher inference throughput per dollar and per watt. Flex Logix’s eFPGA platform enables chips to flexibly handle changing protocols, standards, algorithms, and customer needs and to implement reconfigurable accelerators that speed key workloads 30-100x compared to general purpose processors. Flex Logix is headquartered in Mountain View, California and also has offices in Austin, Texas. For more information, visit https://flex-logix.com.
|
Related News
- Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference
- Flex Logix's Barrie Mullins To present at the 2022 AI Hardware Summit
- Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance
- Flex Logix Discloses Real-World Edge AI Inference Benchmarks Showing Superior Price/Performance For All Models
- Flex Logix Boosts AI Accelerator Performance and Long-Term Efficiency
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |