8kx8 Bits OTP (One-Time Programmable) IP, X-FA- 0.18μm XH018 Modular Mixed Signal Process
Moore's Law Could Ride EUV for 10 More Years
By Alan Patterson, EETimes (September 30, 2021)
ASML plans to introduce new extreme ultraviolet (EUV) lithography equipment that will extend the longevity of Moore’s Law for at least ten years, according to executives at the world’s only supplier of the tools, which are crucial for the world’s most advanced silicon.
Starting in the first half of 2023, the company plans to offer customers equipment that takes EUV numerical aperture (NA) higher to 0.55 NA from the existing 0.33 NA. The company believes that the new equipment will help chip makers reach process nodes well beyond the current threshold (2nm) for at least another 10 years, according to ASML vice president Teun van Gogh, in an interview with EE Times.
“What we typically do is we try to make a tool available that can support our customers in a sort of two-year cadence,” van Gogh said. “When we start shipping high NA, which will be at the end of 2023, we will also have a two-year cadence there to support our customers. We believe that the technology that we offer will bring us well into the next decade to support our customers.”
E-mail This Article | Printer-Friendly Page |
Related News
- Intel's Bohr sees at least 10 more years of scaling
- Moore's Law could enter the fourth dimension--via the third
- Flex Logix Celebrates 10 Years of Success and Innovation
- Are Chiplets Enough to Save Moore's Law?
- Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C
Breaking News
- SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips
- BrainChip Brings Neuromorphic Capabilities to M.2 Form Factor
- Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms
- TSMC December 2024 Revenue Report
- NASA Awards Alphacore Four Contracts for Radiation Hardened Microelectronics Innovation
Most Popular
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- VeriSilicon's Display Processing IP DC8200-FS has achieved ISO 26262 ASIL B certification
- OPENEDGES and TAKUMI partner to promote ORBIT Memory Subsystem IP in Japan
- CEVA Opens New Research and Development Center in Bristol, U.K.
- TTTech divests strategic stake in landmark transaction to NXP to fuel future growth with technology investments in core business