Reshoring Chip Industry Risks Failure With Just More Fabs
By Alan Patterson, EETimes (March 7, 2022)
Reviving U.S. semiconductor production, at the apex of the electronics industry, is unlikely to succeed without also rebuilding the more basic domestic ecosystem of companies in chip assembly and test, according to industry experts.
While U.S. legislators prepare to approve a $52 billion package of incentives to help revive the domestic semiconductor industry, there are concerns that most of the financial support will go to chipmakers that don’t need assistance while the dwindling U.S. assembly and test segment goes neglected.
“There is discussion right now on incentive programs,” Matt Kelly, the chief technologist at global electronics association IPC, said to EE Times. “There’s a lot of concern about just propping up the industry artificially and when the incentives go away, the whole game plan goes away. Unfortunately, that’s — at least from my perspective — where we are right now.”
E-mail This Article | Printer-Friendly Page |
Related News
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
- Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
- Finding Talent to Run New Fabs Might Be Challenging
- Wafer Capacity Forecast to Climb 8.7% As 10 New Fabs Enter Production
- MIPI UFS Controller, MIPI Unipro Controller and MIPI M-PHY IP Cores available in different Fabs and Nodes for all High-density Flash Storage applications in advanced SoCs
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results