PCI Express PHY serial link PIPE Transceiver IP cell/hard macro
Siemens streamlines, secures embedded RISC-V development with latest Nucleus ReadyStart solution
Plano, Texas, USA - May 25 2022 -- Siemens Digital Industries Software announced today availability of its leading Nucleus™ ReadyStart™ solution for embedded development targeting the fast-growing adoption of the RISC-V architecture. Building on one of the industry’s first commercial real-time operating systems (RTOSes) for RISC-V devices, released in 2021, Siemens’ newest Nucleus ReadyStart embedded development solution includes a host of new features that help customers enhance the security, flexibility, and cloud connectivity of their next-generation embedded products based on the RISC-V architecture.
Nucleus ReadyStart for RISC-V incorporates integrated software, IP, tools and services into a single, “ready-to-use” solution ideal for applications where a small footprint, advanced connectivity, and deterministic performance are essential. This enhanced RISC-V integrated development solution allows users to design and experiment with a proven RTOS and added software services from Siemens. It is ideal for device manufacturers targeting the aerospace, automotive, industrial, medical, and general embedded industries.
“Nucleus ReadyStart for RISC-V addresses the requirements needed for today’s advanced and secure edge-to-cloud devices with proven technology,” said Scot Morrison, vice president and general manager, Embedded Platform Solutions at Siemens Digital Industries Software. “Providing a robust and integrated solution for RISC-V devices is critical for embedded developers today, especially with the competitive pressures to deliver innovative devices with shortened time-to-market and cost constraints. Nucleus ReadyStart for RISC-V includes SMP, POSIX, Debug Agent, and security protocols from wolfSSL/OpenSSL. Users can also connect their device to the cloud with the Nucleus IoT Framework Add-on which supports several cloud services and providers such as Amazon Web Services (AWS), Microsoft Azure and MindSphere®, the industrial IoT as a service solution from Siemens. These new capabilities enable RISC-V-based embedded developers to customize rich features to meet the needs of today’s advanced device manufacturers.”
Siemens is an active member of the RISC-V Alliance and has been involved in its development and adoption since 2019. To learn more about Nucleus ReadyStart for RISC-V, visit https://www.plm.automation.siemens.com/global/en/products/embedded/nucleus-readystart.html
Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit siemens.com/software. Siemens Digital Industries Software – Where today meets tomorrow.
|
Related News
- Siemens enhances Nucleus ReadyStart for Arm platforms with enhanced debug, security and stability features
- Siemens extends support for Samsung Foundry's latest process technologies
- Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration
- Siemens pioneers commercial grade Linux support for the RISC-V architecture
- Siemens extends support of multiple IC design solutions for TSMC's latest processes
Breaking News
- Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- After TSMC fab in Japan, advanced packaging facility is next
- A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
Most Popular
- After TSMC fab in Japan, advanced packaging facility is next
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
- Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
E-mail This Article | Printer-Friendly Page |