Wi-Fi 6 (AX)/BLE/15.4 22nm Combo RF IP Core, Licensed to a leading Chinese Semiconductor Company for IoT Chipset
13th June 22 - T2MIP, the global independent semiconductor IP Cores provider & Technology expert, is pleased to announce that one of its partner’s Wi-Fi 6 (AX) + BLE v5.3 + 15.4 Combo RF Transceiver IP Core in 22ULL has been licensed to a leading Chinese Semiconductor Company coupled with Wi-Fi IOT STA from leading wireless Digital IP supplier to provide a complete IoT SoC solution. The target market includes IOT, Smart Lights, Smart home, industrial applications, medical monitoring, building automations, etc.
The Wi-Fi 6 (AX) + BLE v5.3 + 15.4 Combo RF Transceiver IP Core is fully compliant with Wi-Fi Alliance IEEE 802.11ax (Wi-Fi 6) standard, IEEE 802.15.4 standard & the Bluetooth LE (BLE) v5.3 standard, integrating all functional blocks including +20dBm PA, Tx/Rx 2.4GHz 20/40MHz Bandwidth, PMU & Interfaces. The WiFi and Bluetooth operate concurrently with the system’s Co-Existence feature allowing the traffic to be managed for minimum interference.
The Co-existence in the IP Cores provides a robust radio performance, enables lower power consumption and increased security capabilities for IoT applications such as wearables, logistics, smart homes, smart lighting, sensors, appliances, etc.
The architecture further enables enhanced security by taking benefits of both WiFi and Bluetooth Low Energy (BLE) security features such as hardware encryption, secure boot, application-level security and secure over the air (OTA)
For further information on licensing options, deliverables and pricing please drop a request
T2M’s broad Wireless IP cores also include Bluetooth Dual-mode v5.3 RF Transceiver IP Cores in 22ULL, BLE v5.2 / 15.4 (0.5mm2) RF Transceiver IP Cores in 40ULP & SMIC 55/40nmnm, NB-IoT/Cat M/GNSS UE RF Transceiver IP Cores in 40ULP, 5G RF Transceiver IP Cores, GNSS L1/2/5 Receiver RF IP Cores all can be ported to other nodes and foundries as per the customer requirements, as well as BLE v5.3 Controller Link Layer IP, BLE & BT DM SW Stack & Profiles, ZigBee 3 Protocol Stack SW, NB-IOT PS SW..
Availability: These RF Transceiver IP Cores are available for immediate licensing. For further information on licensing options and pricing please drop a request at contact.
About T2M: T2M-IP is the global independent semiconductor technology expert, supplying complex semiconductor IP Cores, Software, KGD, and disruptive technologies enabling accelerated development of your Wearables, IOT, Communications, Storage, Servers, Networking, TV, STB, and Satellite SoCs. For more information, please visit: www.t-2-m.com
|
T2M Hot IP
- Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in TSMC22nm ULP
- GNSS Ultra low power (GPS, Galileo, GLONASS, Beidou3, QZSS, IRNSS, SBAS) Digital ...
- USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP, Silicon Proven in TSMC 28HPC+
- DVB-S2X WideBand Demodulator & Decoder IP (Silicon Proven)
- MIPI D-PHY Tx IP, Silicon Proven in TSMC 22ULP
Related News
- Wi-Fi ax + BLE v5.3 + 15.4, 2.4GHz RF Transceiver IP core in 22nm, licensed to a Chinese customer for IoT chipset
- Wi-Fi 6 (ax)/BLE/15.4 22nm Combo RF IP Core, for IoT Application is Available for Immediate Licensing
- Wi-Fi 802.11 ax + Bluetooth LE v5.3 + 15.4 2.4GHz RF Transceiver IP Core in 22nm ULL, available for immediate licensing for IoT applications.
- Empower Your Wi-Fi 6 and Wi-Fi 6E SoCs with 12-Bit 640Msps Dual Channel ADC and DAC IP Cores, Now Available for Immediate Licensing in Silicon Proven 22nm ULL and ULP Technology
- Ultra-low power 5G Sub-6GHz RF Transceiver IP Cores at 22nm, available for immediate licensing for Cellular and Industrial IoT applications
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |