Design & Reuse

Enabling the Chiplet Era: T2M Brings Production-Proven, UCIe-Ready Die-to-Die IP for Chiplet SOCs.

April 27, 2026 -

 

T2M, today announced the commercial availability of its partner’s production-proven die-to-die interface IP core, aligned with the emerging UCIe ecosystem. This solution is already validated in mass production and is now accessible to a broader set of customers through T2M. It enables high-performance, low-latency connectivity across multi-die systems and next-generation chiplet-based architectures. This IP core is built on a robust AIB 2.0-based architecture offering customers a low-risk, deployment-ready path to chiplet integration.

Key Highlights

  • High-Performance Die-to-Die Connectivity: 20 data lanes with DDR signalling at 1.6 Gbps per bump (800 MHz DDR). Aggregate throughput of 32 Gbps per channel
  • Flexible AXI-Based Architecture: Native support for 32-bit AXI transactions. Configurable AXI Master or Slave operation
  • Silicon-Proven Multi-Die Deployment: Successfully deployed in systems interconnecting ARM NI700 and ARM NIC400 across separate dies. Proven interoperability in real production environments
  • Advanced Signal Integrity & Reliability: Built-in ECC (Error Correction Code). PRBS-based self-test capability
  • Flexible Clocking & Configuration: AXI interface clock up to 800 MHz. APB configuration interface up to 100 MHz

Target Applications

  • Chiplet-based SoCs and heterogeneous integration platforms
  • Die-to-die interconnect for AI, HPC, and networking devices
  • Die-to-FPGA high-speed interfacing
  • Advanced multi-die systems requiring scalable bandwidth

Flexible Licensing Model

The IP core is offered through T2M under a WhiteBox licensing model, providing:

  • Unlimited usage across multiple programs
  • Full RTL/source code access
  • No royalties
  • High customization flexibility and design ownership

This approach enables semiconductor companies to accelerate development while maintaining full control over integration and optimization.

Availability: This Die-Die IP Core is available for immediate licensing. For more information on licensing options and pricing, please drop a request / MailTo

About T2M: T2M is a global independent semiconductor technology expert, supplying complex semiconductor IP Cores, Software, KGD, and disruptive technologies enabling accelerated development of your Wearables, IOT, Communications, Storage, Servers, Networking, TV, STB, and Satellite SoCs.