Intel and MediaTek Form Foundry Partnership
MediaTek will use Intel Foundry Services to manufacture new chips for a range of smart edge devices.
SANTA CLARA, Calif., July 25, 2022 – Intel and MediaTek today announced a strategic partnership to manufacture chips using Intel Foundry Services’ (IFS) advanced process technologies. The agreement is designed to help MediaTek build a more balanced, resilient supply chain through the addition of a new foundry partner with significant capacity in the United States and Europe.
MediaTek plans to use Intel process technologies to manufacture multiple chips for a range of smart edge devices. IFS offers a broad manufacturing platform with technologies optimized for high performance, low power and always-on connectivity built on a roadmap that spans production-proven three-dimensional FinFET transistors to next-generation breakthroughs.
“As one of the world’s leading fabless chip designers powering more than 2 billion devices a year, MediaTek is a terrific partner for IFS as we enter our next phase of growth,” said IFS President Randhir Thakur. “We have the right combination of advanced process technology and geographically diverse capacity to help MediaTek deliver the next billion connected devices across a range of applications.”
NS Tsai, corporate senior vice president of Platform Technology & Manufacturing Operations at MediaTek, said, “MediaTek has long adopted a multi-sourcing strategy. We have an existing 5G data card business partnership with Intel, and now extend our relationship to manufacturing smart edge devices through Intel Foundry Services. With its commitment to major capacity expansions, IFS provides value to MediaTek as we seek to create a more diversified supply chain. We look forward to building a long-term partnership to serve the fast-growing demand for our products from customers across the globe.”
IFS was established in 2021 to help meet the surging global demand for advanced semiconductor manufacturing capacity. IFS is differentiated from other foundry offerings with a combination of leading-edge process and packaging technology, a world-class IP portfolio, and committed capacity in the United States and Europe. IFS customers will reap the benefits of Intel’s recently announced factory expansions at existing sites, as well as plans for major new investments in greenfield sites in Ohio and Germany.
|
Related News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion
- Flex Logix Joins Intel Foundry USMAG Alliance
- Partners Applaud Intel Foundry's Wider Ecosystem Approach
- Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
E-mail This Article | Printer-Friendly Page |