Market Dynamics, Technologies Drive Automotive Design
By Gary Hilson, EETimes (November 11, 2022)
Likening the modern automobile to a server on wheels is starting to sound cliché, but we’re just hitting the tip of iceberg when it comes to the number of electronic components that are finding their way into modern automotive design, as well as the supporting infrastructure for autonomous driving in large urban centers.
In the meantime, the ground underneath is constantly shifting: Supply chain constraints, software defined architectures, functional safety requirements, and the changing dynamics among original equipment manufacturers (OEMs), tier 1 suppliers, and semiconductor companies are altering the landscape of automotive electronics. This dynamic environment was the subject of discussion in a recent panel hosted by ProteanTecs, and, judging from that talk, “changing” may be an understatement.
E-mail This Article | Printer-Friendly Page |
Related News
- IoT and Automotive to Drive IC Market Growth Through 2020
- Intrinsic ID Launches First Hardware Root-of-Trust Solution to Meet Functional Safety Standards for Automotive Market
- New MIPS CEO Sameer Wasson to Drive Company's RISC-V Market Penetration and Innovation
- Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
- Imagination and Telechips drive automotive display diversity with hardware virtualization
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India