Market Dynamics, Technologies Drive Automotive Design
By Gary Hilson, EETimes (November 11, 2022)
Likening the modern automobile to a server on wheels is starting to sound cliché, but we’re just hitting the tip of iceberg when it comes to the number of electronic components that are finding their way into modern automotive design, as well as the supporting infrastructure for autonomous driving in large urban centers.
In the meantime, the ground underneath is constantly shifting: Supply chain constraints, software defined architectures, functional safety requirements, and the changing dynamics among original equipment manufacturers (OEMs), tier 1 suppliers, and semiconductor companies are altering the landscape of automotive electronics. This dynamic environment was the subject of discussion in a recent panel hosted by ProteanTecs, and, judging from that talk, “changing” may be an understatement.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- IoT and Automotive to Drive IC Market Growth Through 2020
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- Intrinsic ID Launches First Hardware Root-of-Trust Solution to Meet Functional Safety Standards for Automotive Market
Breaking News
- Weebit Nano and DB HiTek to demonstrate chips integrating Weebit ReRAM at PCIM 2025
- Silvaco Expands Product Offerings in Photonics and Wafer-Scale Plasma Modeling for AI Applications with Acquisition of Tech-X Corporation
- IC'Alps joins Intel Foundry Accelerator program as Value Chain Alliance (VCA) and Design Services Alliance (DSA) partner
- Movellus Debuts Industry-First On-Die Power Delivery Network Analyzer
- Weebit Nano Q3 FY25 Quarterly Activities Report
Most Popular
- Movellus Debuts Industry-First On-Die Power Delivery Network Analyzer
- Intel Foundry Gathers Customers and Partners, Outlines Priorities
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- CFX 0.13µm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs