Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process
January 13, 2023 -- Certus is pleased to announce the release of our ESD library in GlobalFoundries 12nm Finfet process. It offers a wide range of generic voltage solutions: 0.8V, 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V for power domains and I/Os. The library provides ESD solutions from 500V to >8kV HBM; 3A to 12A CDM options targeting 250V to 750V CDM qualifications. Features also include low capacitance RF and SerDes ESD protection: generic <120fF / <70fF solutions for 2kV HBM / 1kV HBM, with optimized <40fF solutions for 1kV HBM. The RF ESD solutions include high linearity for large signal swings and ultra-low leakage.
This ESD library offers complete strategies for a wide range of Flip-Chip, Chiplet, and 2.5D/3D architectures. With its small power clamp footprints of 38x43um for 0.8V and 44x41um for <1.8V, it reduces the cost per wafer. There is the capability to support >5V ESD protection as well. The library is silicon proven and is also tested for radiation-hardened environments, targeting aerospace as well as automotive and industrial applications.
Feel free to reach out to a Certus representative for more information!
|
Certus Semiconductor Hot IP
Related News
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+
- Certus Semiconductor releases I/O library in TowerJazz's 65nm process
- Arasan announces the immediate availability of its MIPI D-PHY IP as Tx Only or Rx Only for the GlobalFoundries 12nm FinFET process node
- Arasan announces the immediate availability of its ultra-low power MIPI D-PHY IP for the GlobalFoundries 12nm FinFET process node
- Brite Semiconductor Releases ONFI 4.2 IO and Physical Layer IP based on SMIC 14nm FinFET Process
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |