TSMC 4nm (N4P) 1.2V/1.8V Basekit Libraries, multiple metalstacks
Esperanto Pivots to HPC and Generative AI
By Sally Ward-Foxton, EETimes (August 22, 2023)
AI chip startup Esperanto recently pivoted its focus from recommendation acceleration to large language models (LLMs) and high-performance computing (HPC), releasing a general-purpose software development kit and PCIe accelerator card for its ET-SoC-1 first generation RISC-V data center accelerator chip.
The company believes its chip is well-positioned to take advantage of the market for LLM inference today, Craig Cochran, a marketing executive at the Mountain View, Calif.-based company, told EE Times.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications
- Esperanto Technologies Announces RISC-V Industry Milestone Of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
- Cadence Enables Next-Gen AI and HPC Systems with Industry's Fastest HBM4 12.8Gbps IP Memory System Solution
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications