SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
By Alan Patterson, EETimes (September 20, 2023)
Semiconductor Manufacturing International Corp. (SMIC) is likely to, in the next few years, again defy the U.S. government by manufacturing chips with feature sizes as small as 5 nm, industry insiders told EE Times.
The production of 7-nm silicon by China’s largest chipmaker just days ago has crossed a red line set by the U.S. government to keep its rival nation stalled at the 14-nm node. SMIC’s widely reported breakthrough erodes the U.S. strategy to use export controls and blacklists to halt China’s technological progress, according to Dick Thurston, former chief legal counsel for Taiwan Semiconductor Manufacturing Co. (TSMC).
“I never had any doubt that they would be doing 7 [nm], and I still don’t have any doubt that they’ll do 5 nm without the EUV tools,” he told EE Times.
E-mail This Article | Printer-Friendly Page |
Related News
- Arm IPO Likely to Lag Early Expectations, Observers Say
- Arm IPO Faces Serious Difficulties, Observers Say
- Socionext Adopts TSMC's 5-nanometer Technology for Custom SoCs Targeting Next-Generation Automotive Applications
- Synopsys Digital and Custom Design Platforms Certified on TSMC 5-nm EUV-based Process Technology
- Synopsys Digital and Custom Design Platform Certified for TSMC's Most Advanced 5-nm Process Technology for Early Design Starts
Breaking News
- TSMC September 2024 Revenue Report
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
- Intel, TSMC to detail 2nm processes at IEDM
- SensiML Expands Platform Support to Include the RISC-V Architecture
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
Most Popular
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports