Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
July 23, 2026 -
A new SemiAnalysis teardown reveals that SMIC’s N+3 node, used in Huawei’s Kirin 9030, achieves a 32.5nm metal pitch—narrower than Intel’s 18A at 36nm. Despite lacking EUV lithography, SMIC leverages DUV and advanced design to match Intel’s density. However, performance and power efficiency still trail behind. With the Fear & Greed Index near neutral, altcoins to watch may attract renewed interest as investors seek undervalued opportunities amid mixed market sentiment.