Rambus Demonstrates CXL Platform Development Kit at SC23
SAN JOSE, Calif.-- November 14, 2023 -- This week at SC23, Rambus will demonstrate a CXL platform development kit (PDK) that enables module and system makers to prototype and test CXL-based memory expansion and pooling solutions for AI infrastructure and other advanced systems. The demonstration will show CXL memory tiering functionality in a production server running industry-standard benchmarking software.
The Rambus CXL PDK is interoperable with CXL 1.1 and CXL 2.0 capable processors and memory from all the major memory suppliers. It leverages today’s available hardware to accelerate the development of the full stack of next-generation CXL-based solutions (device, module, system and software).
The Rambus CXL PDK includes:
- CXL hardware platform (add-in card), featuring Rambus CXL memory controller chip prototype
- Advanced debug and visualization tools
- CXL-compliant management framework and utilities
- Fully customizable SDK for value-added features and vendor-specific commands
Join Rambus at SC23 in the CXL Consortium Booth (Booth 1301) to see the CXL PDK demonstration in action.
To learn more about SC23, visit https://www.rambus.com/event/sc23-supercomputing-2023/. To learn more about the Rambus CXL PDK, visit https://www.rambus.com/cxl-memory-initiative/.
- What: Rambus Demonstrates CXL Platform Development Kit Enabling Memory Tiering for AI Infrastructure
- Who:Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider
- Where: Supercomputing 2023 (SC23) at the CXL Consortium Booth (Booth #1301) at the Colorado Convention Center in Denver, CO
- When: November 14 -16, 2023. Exhibition begins at 10:00 a.m. MT.
About Rambus Inc.
Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.
|
Related News
- Marvell Announces Innovative CXL Development Platform for Multi-Host Memory Pooling
- Microsemi Announces New Development Kit with RTG4 PROTO FPGAs, Providing Space Designers a Comprehensive Evaluation and Design Platform
- PLDA Announces Gen4SWITCH - The Industry's First PCI Express 4.0 Platform Development Kit (PDK)
- Arasan Chip Systems Demonstrates Industry's First UFS 1.0 Link Layer IP and Hardware Development Platform
- Xilinx Ships World's First 28nm FPGA Device and Demonstrates Application Development Platform for Next Generation Systems
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |