GNSS (GPS, Galileo, GLONASS, Beidou3, QZSS, SBAS) Ultra-low power RF Receiver IP
Rambus Demonstrates CXL Platform Development Kit at SC23
SAN JOSE, Calif.-- November 14, 2023 -- This week at SC23, Rambus will demonstrate a CXL platform development kit (PDK) that enables module and system makers to prototype and test CXL-based memory expansion and pooling solutions for AI infrastructure and other advanced systems. The demonstration will show CXL memory tiering functionality in a production server running industry-standard benchmarking software.
The Rambus CXL PDK is interoperable with CXL 1.1 and CXL 2.0 capable processors and memory from all the major memory suppliers. It leverages today’s available hardware to accelerate the development of the full stack of next-generation CXL-based solutions (device, module, system and software).
The Rambus CXL PDK includes:
- CXL hardware platform (add-in card), featuring Rambus CXL memory controller chip prototype
- Advanced debug and visualization tools
- CXL-compliant management framework and utilities
- Fully customizable SDK for value-added features and vendor-specific commands
Join Rambus at SC23 in the CXL Consortium Booth (Booth 1301) to see the CXL PDK demonstration in action.
To learn more about SC23, visit https://www.rambus.com/event/sc23-supercomputing-2023/. To learn more about the Rambus CXL PDK, visit https://www.rambus.com/cxl-memory-initiative/.
- What: Rambus Demonstrates CXL Platform Development Kit Enabling Memory Tiering for AI Infrastructure
- Who:Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider
- Where: Supercomputing 2023 (SC23) at the CXL Consortium Booth (Booth #1301) at the Colorado Convention Center in Denver, CO
- When: November 14 -16, 2023. Exhibition begins at 10:00 a.m. MT.
About Rambus Inc.
Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.
|
Related News
- Marvell Announces Innovative CXL Development Platform for Multi-Host Memory Pooling
- Microsemi Announces New Development Kit with RTG4 PROTO FPGAs, Providing Space Designers a Comprehensive Evaluation and Design Platform
- PLDA Announces Gen4SWITCH - The Industry's First PCI Express 4.0 Platform Development Kit (PDK)
- Arasan Chip Systems Demonstrates Industry's First UFS 1.0 Link Layer IP and Hardware Development Platform
- Xilinx Ships World's First 28nm FPGA Device and Demonstrates Application Development Platform for Next Generation Systems
Breaking News
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- RIKEN adopts Siemens' emulation and High-Level Synthesis platforms for next-generation AI device research
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
Most Popular
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Imagination pulls out of RISC-V CPUs
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
- RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?
E-mail This Article | Printer-Friendly Page |