Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports
MILPITAS, Calif. – November 30, 2023 – Global semiconductor equipment billings contracted 11% year-over-year to US$25.6 billion in the third quarter of 2023, while quarter-over-quarter billings slipped 1% during the same period, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
“The Q3 2023 dip in equipment billings was due to softening chip demand,” said Ajit Manocha, SEMI President and CEO. “However, China has shown strong demand and spending power for mature-node technologies, a sign of the industry's resilience and growth potential in the long run.”
Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry.
Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:
The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:
- Monthly SEMI Billings Report, a perspective on equipment market trends
- Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
- SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market
Download a sample of the EMDS report.
For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at mktstats@semi.org. More details are also available on the SEMI Market Data webpage.
About SEMI
SEMI® connects 3,000 companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more.
|
Related News
- Q2 2023 Global Semiconductor Equipment Billings Dip 2% Year-Over-Year, SEMI Reports
- Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports
- Third-Quarter 2020 Global Semiconductor Equipment Billings Surge 30% Year-Over-Year, SEMI Reports
- Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
- Q1 2024 Global Semiconductor Equipment Billings Edge Down 2% Year-Over-Year, SEMI Reports
Breaking News
- TSMC September 2024 Revenue Report
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
- Intel, TSMC to detail 2nm processes at IEDM
- SensiML Expands Platform Support to Include the RISC-V Architecture
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
Most Popular
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |