VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
Enabling higher quality audio streaming across various applications with lower power and cost
Shanghai, China, March 28, 2024 -- VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). This solution is applicable to mobile phones, Bluetooth earphones including True Wireless Stereo (TWS) earphones, speakers, and other extensive audio application scenarios. The declaration details can be accessed on Bluetooth SIG’s website by searching for its Qualified Design ID (QDID: 206187).
Related |
Bluetooth Low Energy (BLE) RF IP |
LE Audio is the new Bluetooth audio technology standard introduced by Bluetooth SIG based on Bluetooth 5.2 and above specifications, aiming to deliver a higher quality audio experience. VeriSilicon’s complete BLE IP solution includes RF IP, baseband IP, software protocol stack, and has already passed the Bluetooth 5.3 certification. This solution leverages BLE technology, offering lower power consumption, and employs Isochronous Channels transmission technology for lower audio transmission latency and improved signal quality. Moreover, the solution also supports innovative Bluetooth capabilities of LE Audio such as Auracast™ broadcast audio and Multi-Stream Audio.
VeriSilicon’s complete BLE IP solution integrates its self-developed LC3 to deliver real-time, low-power, and low-distortion audio processing. It supports various calculation precisions including 16-bit, 32-bit fixed-point processing, and 32-bit floating-point processing, while also accommodating all audio profiles of LE Audio, thus catering to diverse application scenarios. It has been deeply optimized for VeriSilicon’s ZSP Digital Signal Processor (DSP) and mainstream processors like Arm Cortex-M and RISC-V, minimizing memory and CPU resource usage, and can be easily ported to other MCUs and DSPs. VeriSilicon’s LC3 can be licensed independently for flexible integration. When seamlessly integrated with VeriSilicon’s BLE controller and protocol stack, it can also provide customers with a complete LE Audio hardware and software solution, streamlining the development process for high-performance audio products.
“Through years of dedicated work in Bluetooth technology, we have developed hardware reference designs and application software solutions tailored to different market demands based on our proprietary IPs and IoT embedded software platforms. Obtaining full LE Audio certification will further empower our customers to develop next-generation audio products more efficiently with reduced power consumption and costs, thus expediting product launches,” said Wiseway Wang, Senior Vice President and General Manager of Custom Silicon Platform Division at VeriSilicon. “Moving forward, VeriSilicon will explore new LE Audio application scenarios, bringing more comprehensive solutions to customers. We also look forward to seeing our customers launch more innovative LE Audio products by leveraging VeriSilicon’s solutions to jointly propel the advancement of Bluetooth audio technology and market.”
About VeriSilicon
VeriSilicon Microelectronics (Shanghai) Co., Ltd. (VeriSilicon, 688521.SH) is committed to providing customers with platform-based, all-around, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. Under the unique "Silicon Platform as a Service" (SiPaaS) business model, depending on the comprehensive IP portfolio, VeriSilicon can create silicon products from definition to testing and packaging in a short time, and provides high-performance and cost-efficient semiconductor alternative products for fabless, IDM, system vendors (OEM/ODM), large internet companies and cloud service providers, etc. VeriSilicon's business covers consumer electronics, automotive electronics, computer and peripheral, industry, data processing, Internet of Things (IoT) and other applications.
VeriSilicon presents a variety of customized silicon solutions, including high-definition video, high-definition audio and voice, in-vehicle infotainment, video surveillance, IoT connectivity, smart wearable, high-end application processor, video transcoding acceleration and intelligent pixel processing, etc. In addition, VeriSilicon has six categories of in-house processor IPs, namely GPU IP, NPU IP, VPU IP, DSP IP, ISP IP and Display Processor IP, as well as more than 1,500 analog and mixed signal IPs and RF IPs.
Founded in 2001 and headquartered in Shanghai, China, VeriSilicon has 7 design and R&D centers in China and the United States, as well as 11 sales and customer service offices worldwide. VeriSilicon currently has more than 1,800 employees.
|
Verisilicon, Inc. Hot IP
Related News
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
- VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
- Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP
- CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification
- Imagination and Packetcraft announce partnership for low energy audio
Breaking News
- Comcores Announces Availability of its Ultra-Compact Ethernet TSN End Station Controller IP for Automotive Networks
- Now Gelsinger is gone, what is Intel's Plan B?
- X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology
- Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation
- Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections
Most Popular
- Intel Announces Retirement of CEO Pat Gelsinger
- Tenstorrent closes $693M+ of Series D funding led by Samsung Securities and AFW Partners
- Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters
- MIPS Releases P8700, Industry's First High-Performance AI-Enabled RISC-V Automotive CPU for ADAS and Autonomous Vehicles
- Arteris Deployed by Menta for Edge AI Chiplet Platform
E-mail This Article | Printer-Friendly Page |