Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
Flex Logix Patents & Applications Surpass 100
MOUNTAIN VIEW, Calif. , April 25, 2024 -- Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DSP/SDR/AI solutions, announced that it now has over 100 total worldwide patents and applications on fundamental inventions that enable the best reconfigurable solutions for FPGA, DSP/SDR and AI.
EFLX eFPGA has PPA (power/performance/area) metrics comparable to the established FPGA suppliers. And EFLX is available or in design for over a dozen nodes from 180nm to 18A. This enables SoCs to incorporate power and cost effective flexibility for changing algorithms, standards and customer needs. A traditional FPGA fabric is designed over several years by 50-100 engineers. Flex Logix delivers similar results in less than a year with a 1/10th of the people. This is because Flex Logix has numerous fundamental inventions for a very different type of interconnect that uses half the transistors and half the metal layers. And Flex Logix has more inventions allowing a modular design approach to span customer needs from 200 to >1 Million LUTs (and DSP/BRAM).
InferX DSP/SDR/AI PPA is superior to existing IP solutions and is fully reconfigurable. This is because of fundamental inventions that allow for arrays of hard wired TPUs to be controlled with very high utilization of compute resources by Softlogic operators running on EFLX eFPGA that controls execution.
"I am proud of the culture of practical innovation in the Flex Logix hardware and software team," said Geoff Tate, CEO of Flex Logix. "From Cheng Wang, our CTO/SVP, down our team constantly innovates to find better solutions to customers' needs. This has resulted in us becoming the leading eFPGA supplier with dozens of customers and now a supplier of the best reconfigurable DSP/SDR/AI."
About Flex Logix
Flex Logix is a reconfigurable computing company providing leading edge eFPGA, DSP/SDR and AI Inference solutions for semiconductor and systems companies. Flex Logix eFPGA enables volume FPGA users to integrate the FPGA into their companion SoC, resulting in a 5-10x reduction in the cost and power of the FPGA and increasing compute density which is critical for communications, networking, data centers, microcontrollers and others. Its scalable DSP/SDR/AI is the most efficient, providing much higher inference throughput per square millimeter and per watt. Flex Logix supports process nodes from 180nm to 7nm, with 5nm, 3nm and 18A in development. Flex Logix is headquartered in Mountain View, California and has an office in Austin, Texas. For more information, visit https://flex-logix.com.
For general information on InferX and EFLX product lines, visit our website at this link.
|
Related News
- Industry Leading PPA DSP Available For All Existing EFLX eFPGA
- Flex Logix Boosts AI Accelerator Performance and Long-Term Efficiency
- Flex Logix Cancels AI Chip, Markets IP for AI and DSP
- Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |