Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus
By Alan Patterson, EETimes (July 16, 2024)
Samsung has slowed the ramp of its new fab in Taylor, Texas, despite the Department of Commerce (DoC) conditionally awarding the company a $6.6 billion stimulus package under the CHIPS Act. The DoC told EE Times that the subsidies for Samsung and other CHIPS Act winners are not final yet.
On April 15, the DoC and Samsung signed a non-binding agreement providing up to $6.4 billion in direct funding under the CHIPS Act to help revive chipmaking in the U.S. During a quarterly results announcement on April 30, Samsung said that it delayed the production start for the Taylor fab project from the second half of 2024 to “maybe 2026.”
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Samsung Selects Texas as Site for $17 Billion Fab
- Samsung to spend $1.9 billion on logic fab, says report
- IBM, Samsung and GLOBALFOUNDRIES Set for Fab Synchronization to Produce Advanced Chips Based on 28nm Process Technology with STMicroelectronics
- SkyWater to Acquire Infineon's Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
Breaking News
- Zero ASIC launches world's first open standard eFPGA product
- Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce
- SoftBank Group to Acquire Ampere Computing
- Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications
- Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell and AI to Speed Electronic Design Automation
Most Popular
- KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core
- Cadence Joins Intel Foundry Accelerator Design Services Alliance
- Sofics and Dolphin Semiconductor Announce Strategic Partnership
- BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM
- China Bets on Homegrown Chip Tech With RISC-V Push