Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms
Wavre, Belgium and Los Altos, California, January, 13rd, – Exostiv Labs has released the addition of device support for AMD Versal™ Adaptive SoCs to its cutting-edge Exostiv and Exostiv Blade platforms, including support for the world’s largest FPGA, the AMD Versal Premium VP1902. This latest development expands the platforms’ compatibility, already available for AMD 7 Series FPGAs and AMD UltraScale™, UltraScale+™, and Zynq™ adaptive SoCs, to meet the high-performance debugging needs of Versal users.
Unlocking Massive Data Capture for Versal Devices
Exostiv Labs specializes in delivering unmatched internal capture capabilities for single and multi-FPGA systems. By harnessing the power of AMD adaptive computing devices, engineering teams can design more robust, reliable, and innovative FPGA-based and SoC prototypes in FPGA solutions. With Exostiv Labs’ unique focus on live, massive data-oriented debug, users can master complex systems and accelerate time-to-market like never before, by reducing the validation and debug time by several orders of magnitude, hence saving substantial engineering resources and getting products to market much faster. Additionally, Software Teams can now work much earlier in the development cycle with the Hardware Team, thanks to the real time debugging capability the Exostiv Labs platforms offer.
Key Features for Versal Users:
- Massive Capture Power: Capture terabytes of live data from millions of internal nodes across multiple Versal devices simultaneously.
- High-Speed Instrumentation: Support for Versal devices running up to 800 MHz, with minimal resource footprint.
- Seamless Connectivity: Works with any board offering Versal transceiver connections up to 28.125 Gbps.
- Versatility: Debug issues, explore edge cases, and validate systems against real-world conditions with ease.
“Versal is the epicenter of validation and debug innovation in ASIC/SoC prototyping and advanced programmable systems,” said Frederic Leens, CEO of Exostiv Labs. “We’re now in the terabyte era—it’s time to transform FPGA prototyping by directly tapping into the internal workings of Versal devices for unparalleled visibility and debugging capabilities. Exostiv Labs is proud to be a member of the Adaptive Computing Partner program with AMD”.
“We are excited to see Exostiv Labs adding support for our flagship Versal adaptive SoC devices,” said Mike Rather, senior product line manager, AMD. “Versal adaptive SoCs offer tremendous flexibility and performance for the most demanding applications, and AMD fosters a thriving ecosystem of partners dedicated to supporting their innovation with our products. We congratulate Exostiv on this milestone and look forward to seeing how our customers will benefit from these new capabilities.”
Available Now
Exostiv Probe and Exostiv Blade for AMD Versal are ready to revolutionize your development process. Discover how Exostiv Labs can elevate your projects: www.exostivlabs.com.
|
Related News
- Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs
- Silicon Labs and ARM Collaborate to Drive the Future of Low-Power ARM mbed IoT Device Platforms
- EVE Unveils Wireless SoC Accelerated Validation Platforms
- IMEC unveils tools to speed design of energy-efficient multi-processor SoC platforms
- Xylon Announces New logicBRICKS Vision AI Framework for AMD Adaptive SoCs
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |