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Mar. 12, 2019 –

Attopsemi Scales I-fuse® Technology to 7nm FinFET following 12nm Silicon Success (February 4, 2026)
Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels (December 3, 2025)
Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB's 180nm Platform (February 26, 2025)
DENSO Adopts Attopsemi's OTP to Upgrade Future Automotive Products (July 17, 2023)
Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (April 24, 2023)

EnSilica to sponsor Tiny Tapeout workshop at the University of Sheffield (February 22, 2026)
Ceva to Participate in Upcoming Investor Conferences and Industry Events (February 22, 2026)
Funding must be activated for semiconductor success (February 22, 2026)
Europe Doubles Down on Semiconductor Strengths (February 22, 2026)
Europractice 2.0 secures EU funding until September 2028 (February 22, 2026)