Israeli Semiconductor Consortium Licenses Flex Logix's Embedded FPGA Technology
Represents up to seven new customers for Flex Logix’s leading EFLX Platform
MOUNTAIN VIEW, Calif. -- January 22, 2018 – Flex Logix™ Technologies, Inc., today announced that its embedded FPGA technology will be used by a consortium of Israeli semiconductor and systems companies including Mellanox, Satixfy, DSP Group and AutoTalks under a license with Bar Ilan’s SoC Lab which is part of the HiPer Consortium. The consortium will leverage Flex Logix’s EFLX™ platform to design an architecture and technology 16nm evaluation chip and then use Bar Ilan University’s SoC Lab to prove out and implement a chip that can be used by each member company. Bar Ilan is one of the top technology universities in Israel and is located in the Tel Aviv District.
“After evaluating multiple suppliers of embedded FPGA IP, we chose the Flex Logix EFLX platform because it provided the best technical solution and offered the most scalability for a wide range of applications,” said Aner Shoam, CTO of HiPer Consortium. “We are excited by the flexibility enabled by EFLX, which will allow us to customize a single chip for multiple markets and/or upgrade the chip while in the system to adjust to changing standards such as networking protocols.”
“We have seen increased demand for EFLX in Israel due to the large number of leading-edge chip and systems companies in the region that can benefit greatly by the power and flexibility of embedded FPGA,” said Geoff Tate, CEO of Flex Logix. “Flex Logix has been very focused on the Israel market since 2015 when we established local sales channels. We have attended both major Israel technology shows, SemIsrael and ChipEx, and we have technical people visiting Israel regularly. We look forward to helping these companies gain a competitive advantage with their chip designs.”
As part of the agreement, Flex Logix will provide the EFLX Compiler and one or more arrays based on the 16nm EFLX4K IP core.
About the HiPer Consortium
The HiPer Consortium works together to identify and prove out emerging technologies of common interest, then works through Bar Ilan University’s Lab to implement a chip that proves out the technology and architectural implementations. The chip using Flex Logix’s embedded FPGA will be the second chips designed by the consortium. Its first chip was in 28nm and was successful on first silicon.
About Flex Logix
Flex Logix, founded in March 2014, provides solutions for reconfigurable RTL in chip and system designs using embedded FPGA IP cores and software. The company's technology platform delivers significant customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps, and bringing greater flexibility to customers’ hardware. Flex Logix has raised more than $12 million of venture capital. It is headquartered in Mountain View, California and has sales rep offices in China, Europe, Israel, Japan, Taiwan and Texas. More information can be obtained at http://www.flex-logix.com .
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