China Foundry Seeks Shared Model
Guangzhou joins the provincial race for fabs
Rick Merritt, EETimes
1/29/2018 00:01 AM EST
SAN JOSE, Calif. — A plan for a billion-dollar fab in Guangzhou, China, aims to pool investments from fabless companies, creating a built-in customer base. It is the latest addition to a growing list of projects as the country tries to build up its semiconductor sector.
The so-called CanSemi project announced plans to build a 300-mm fab capable of producing 30,000 wafers/month. It would be a crown jewel of the Guangdong provincial capital, formerly known as Canton, that has aggressively courted investments from many electronics companies in recent months, including Foxconn and LG.
The CanSemi project, also known Guangzhou Yuexin or YPC, aims to start operations as early as 2019, according to a Dec. 26 report from ESM China, a sister publication of EE Times. Richard Chang, the Taiwan-born founder of China’s largest foundry, Semiconductor Manufacturing International Corp. (SMIC), is said to lead the project.
E-mail This Article | Printer-Friendly Page |
Related News
- China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce
- Intel Provides Update on Internal Foundry Model
- SkyWater CEO Expands "Technology Foundry" Model
- China Forecast to Represent 22% of the Foundry Market in 2020
- China Only Region to Register Pure-Play Foundry Market Growth in 2019
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance