MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Knowledge Transfer, or IP Theft?
Nitin Dahad, EETimes
November 5, 2018
What can be characterized in good times as helping emerging economies develop knowledge or technology can look quite different when things get messy.
That’s a bit of a tongue-in-cheek headline. I’m not attempting to even suggest that they are two sides of the same coin or that IP theft is acceptable.
However, with the U.S. government charging Taiwanese foundry UMC and Chinese DRAM maker Fujian Jinhua Integrated Circuit Co. with conspiracy to steal intellectual property from Micron Technology, it made me think about two things: the software and engineering outsourcing industry, and about government-to-government relations.
E-mail This Article | Printer-Friendly Page |
Related News
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024