The TSMC and Huawei Announcements Are Not as Linked as You May Think
By Jim McGregor, EETimes (May 22, 2020)
The industry was rocked last week by two U.S. announcements that seem interconnected. The first was the Trump Administration’s announcement banning any U.S chip and equipment sales to Huawei and ZTE. The second was the announcement that TSMC would build a state-of-the-art fab in Arizona. While national security may be a common thread in the two announcements, the factors and ramifications of the individual announcements are much greater.
War on Huawei and ZTE
The U.S. government has fined, banned, and now embargoed Huawei and ZTE for multiple reasons, including violating export controls of technology shipments to embargoed and sanctioned countries and charges of intellectual property (IP) theft. To be fair, China’s policy of requiring foreign countries to form a joint venture with a Chinese company and to share IP in order to do business in the country has been an open door to IP theft. Huawei recently accused the U.S. of implementing protectionary policies — when navigating Chinese protectionism has been part of doing business in China for decades.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications