SmartDV Joins Open RF Association
Commits to Help Create Open 5G Ecosystem to Accelerate Adoption, Growth of 5G Solutions
SAN JOSE, CALIF. –– January 13, 2022 –– SmartDV™ Technologies today joined the Open RF Association (OpenRF™), an industry consortium dedicated to creating an open 5G ecosystem of interoperable hardware and software across member multi-mode radio frequency (RF) front-end and chipset platforms.
As the organization’s newest associate member, SmartDV, the leading supplier of Design and Verification Intellectual Property (IP), will work with other members to drive adoption of 5G technology.
“We fully support OpenRF’s mission for an open and interoperable 5G ecosystem and commit to help accelerate the rate of adoption and build-out of 5G solutions,” states Deepak Kumar Tala, SmartDV’s managing director. “SmartDV’s portfolio has Design and Verification IP targeted to reducing time to market and increasing quality and performance for 5G products and applications.”
“I am pleased to welcome SmartDV Technologies as an associate member,” says Kevin Schoenrock, Open RF Association president. “The OpenRF community looks forward to SmartDV’s expertise and the contribution it will make to our ongoing efforts to to support a robust ecosystem of interoperable RF front-end and chipset platforms.”
To learn more about the Open RF Association visit https://openrf.com/.
About SmartDV
SmartDV™ Technologies offers the world’s broadest portfolio of Design and Verification intellectual property (IP), giving its customers a distinct competitive edge by delivering high-quality, proven IP and productivity tools that speed time to market. That’s why its IP is in use today by more than 200 customers worldwide, including seven of the top 10 semiconductor companies and four of the largest consumer electronics companies. SmartDV’s support spans 5G, automotive, defense and aerospace, mobile, networking, SoC, serial bus, storage and video and display markets and protocols. SmartDV covers the design and verification flow from simulation, emulation, formal and post-silicon validation and memory modeling with more than 800 Design IP and Verification IP products. It offers outstanding customer service with more than 250 experienced ASIC and SoC design and verification engineers, 24/7 technical support, a global footprint through local sales and support offices in all major geographies. SmartDV is headquartered in Bangalore, India, with U.S. headquarters in San Jose, Calif., and sales offices in China, Europe, Israel, Japan, Korea, Malaysia, Taiwan, Russia, Singapore and Turkey
|
SmartDV Technologies Hot IP
SmartDV Technologies Hot Verification IP
Related News
- Open RF Association and MIPI Alliance Sign Cooperation Framework (Liaison) Agreement
- AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design
- Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
- SmartDV Charts Course Toward Chiplets, Joins Universal Chiplet Interconnect Express (UCIe)
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |