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Silicon on Chip design resources
Silicon on Chip design resources
Leading foundry TSMC could partner with Robert Bosch and two other automotive suppliers to create a joint-venture 300mm fab in Germany that will target a 28nm process technology, according to reports in Digitimes.
www.eenewsanalog.com/, Apr. 14, 2023 –
A TSMC fab in Germany targeting a 28nm process is a less advanced development than previously expected – but also a more affordable one (see TSMC's Dresden fab talks reach advanced stage, says report). While targeting 28nm could go some way to addressing security of automotive chip supply – an issue that got Germany's attention during the pandemic crisis – it would do nothing for European strategic security and the region's ability to manufacture at the leading-edge.
One report said that discussions are still ongoing and focus on how Bosch and other partners can assume the risks around manpower, labor unions and production efficiency.
A spokesperson for Bosch said the company would not comment on the reports.
If the deal can be made TSMC would be following a similar finance model to one it has already pursued with Sony in Japan (Japan to provide 40 percent subsidy to TSMC, Sony venture) and would likely expect a similar level of subsidy.
Japan faces a similar problem to Europe: the need to meet volume supply chain needs behind the leading-edge of chip technology, and the strategic issue of remaining capable of chip manufacturing into the future, with sub-10nm production. Japan's solution has been to have two initiatives. The TSMC, Sony, Denso joint venture addresses some medium-term volume needs , while Rapidus Corp. has been formed to aim at 2nm production later this decade (see Rapidus secures US$2.3 billion to start 2nm wafer fab). However, while Japan has moved relatively quickly, discussions have dragged on for a couple of years in Europe.