Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
May 14, 2026 -
TES Electronic Solutions GmbH expands its on-chip sensor IP portfolio by offering new linear temperature sensor and over-temperature detector IPs implemented in X-FAB XT018 - 0.18µm BCD-on-SOI technology. The sensors are suitable for complex system-on-chip packages where power density increases and thermal control and management is required. The following IPs are now available:
Linear Temperature Sensor generating an output voltage which is linearly increasing with junction temperature and trimmable to 2V at 60°C
Over-Temperature Detector A hysteresis detector that asserts output OVERTJ once junction temperature exceeds 147°C and subsequently stays above 138°C
Both IP cores show robustness and high reliability as their minimum continuous operation lifetime is 100,000 hours, making them suitable for automotive, industrial, and consumer electronics where long-term stability is primary.
TES will make supporting your design effort a priority – whether it is integrating this IP into your design or implementing a complete ASIC.
For more information on this and other IP solutions, visit the TES IP products page.
Contact
For inquiries, please email info@tes-dst.com
About TES
With over 20 years of experience in ASIC design and embedded graphics IP, TES is a one-stop partner for high-performance semiconductor solutions. Our IP portfolio includes highly customizable 2D, 2.5D, and 3D GPUs, display controllers, and a wide range of analog and digital IP blocks, ranging from SiGe RF to industrial ASIC solutions.
Headquartered near Stuttgart, Germany, TES Electronic Solutions GmbH serves a global customer base, with design operations in Stuttgart and graphics IP development in Hamburg. Learn more at www.tes-dst.com.