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Fraunhofer IPMS hosts workshop on scaling quantum chip production

October 1, 2026 -

by Dr. Donovan, quantumzeitgeist.com

As superconducting quantum processors approach the 1,000-qubit threshold, a milestone IBM Quantum anticipates reaching by 2029, a critical bottleneck in scaling is coming into focus: reliably testing and qualifying the individual chiplets that comprise these complex systems. At the QBN Workshop in Dresden, Dr. Thorsten Last of OrangeQS will present how the company is adapting its MAX product line for non-destructive, automated chiplet testing prior to their integration into modular quantum processors. OrangeQS argues this data is also key to quantum chip production, identifying critical process steps and improving performance prediction.

Chiplet Qualification and MAX Testing for Modular Processors

OrangeQS is adapting its MAX product line to perform non-destructive, automated testing of quantum chiplets as the industry moves towards building larger, modular processors. This testing occurs prior to their integration, addressing a key bottleneck in scaling superconducting quantum systems. The company’s approach focuses on ensuring each chiplet meets performance criteria before assembly, streamlining the manufacturing process and reducing potential failures in complex, multi-chip architectures.

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