Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
August 13, 2026 -
Recently, the "AI ASIC Chip Design Platform R&D and Application" project independently developed by Joinsilicon Microelectronics (Beijing) Co., Ltd. completed the registration of scientific and technological achievements with the Ministry of Industry and Information Technology. It was recognized by the expert evaluation committee organized by the National Industrial Information Security Development Research Center as reaching an internationally advanced level in overall technology. Meanwhile, the evaluation opinion noted that this achievement possesses independent intellectual property rights, has broad application prospects, and delivers significant economic and social benefits.
This recognition as a national-level scientific and technological achievement, rated at an internationally advanced level, marks that the relevant technological achievements of the AI ASIC chip design platform independently built by Joinsilicon have received national-level authoritative recognition. The platform addresses the rapidly growing demands of the artificial intelligence industry, conducting technical research and development across the full-process design chain of AI-specific chips. It has achieved a series of key technological breakthroughs in core areas such as algorithm adaptation, architecture optimization, and engineering implementation, enabling it to provide flexible and efficient customized chip solutions for AI computing power needs across different scenarios.
As an enterprise deeply engaged in the field of AI chip design, Joinsilicon has always adhered to independent innovation. The successful passing of this scientific and technological achievement evaluation marks an important milestone in Joinsilicon's technology research and development journey. In the future, Joinsilicon will continue to consolidate its core technology foundation, drive the technological iteration and industrial application of its AI ASIC chip design platform, serve the construction of domestic computing power infrastructure with advanced chip design capabilities, and provide strong support for the high-quality development of the artificial intelligence and integrated circuit industries.