Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
August 17, 2026 -
TSMC has doubled its advanced packaging production capacity every year for the past three years, the company revealed. The foundry now operates 10 dedicated facilities, yet still cannot fully meet AI semiconductor demand. Samsung Electronics is expanding its collaboration with Broadcom beyond HBM supply to include sub-2nm foundry processes and advanced packaging, while accelerating construction of its 2nm mass production infrastructure at its Taylor, Texas plant. Meanwhile, both companies have aligned on deferring commercial deployment of High-NA EUV lithography equipment until the 1nm node around 2030. In the memory market, SanDisk unveiled bullish long-term targets that sent its stock soaring approximately 14%, triggering a broad rally across related names. Tokyo markets also saw continued inflows into semiconductor stocks, with the Nikkei 225 reclaiming the 68,000 level for the first time in about a month.