Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
August 24, 2026 -
Rapidus has laid out its advanced packaging roadmap at the 2026 OCP APAC Summit, with eight-reticle-size interposers and 600 x 600 mm panel-level processing as the targets for around 2030. The roadmap was presented by Rapidus Design Solutions CTO Rozalia Beica and shows steps through interposer sizes from four reticles (3,320 mm²) to six (4,980 mm²) and eventually eight (6,640 mm²) by 2030. The 600 x 600 mm panel format is the most important target of that plan as the yield advantage at panel scale is substantial. CTO Beica illustrated the output difference in a simple manner: an eight-reticle interposer yields four units on a standard 300 mm wafer, nine on a 300 x 300 mm panel, 36 on a 510 x 515 mm panel, and 49 on a 600 x 600 mm panel.