Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
October 5, 2026 -
By Dr Usman Saleem
SemiAnalysis has published a teardown of Intel's Panther Lake (Core Ultra 7 365), offering a rare look at 18A inside a shipping chip. Intel's 18A node brings advanced manufacturing technologies such as rear-side power delivery and a new transistor design, so its success is vital for the Foundry. The firm found the 18A compute logic to be similar in density to the TSMC N3E logic used in the 12-core Xe3 GPU tile. It also puts 18A about 18.6% denser than the Intel 3 GPU logic, using a representative-cell model. However, SemiAnalysis says 18A does not lead TSMC N3P, N2, or Samsung SF2 in peak density. It further cautions that whole-die density depends on cell mix and placement.