Nordic Semiconductor proves Bluetooth High Data Throughput feature in silicon

November 2, 2026 -

Bluetooth High Data Throughput is a major enhancement to Bluetooth Low Energy’s capabilities, increasing the maximum transfer speed almost fourfold without leaving the wireless technology, software, and tools product makers already rely on.

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today became the first to prove the upcoming Bluetooth® High Data Throughput (HDT) feature in silicon. Nordic is among the first vendors to showcase support for Bluetooth HDT. 

With support for longer packets, Bluetooth HDT will let wearables, smart home devices, PC accessories, hearing aids, and other Bluetooth Low Energy (LE) products transfer data significantly faster, while retaining Bluetooth LE’s energy efficiency. 

Built on the Bluetooth LE billions of devices already use  

Nordic will bring Bluetooth HDT to developers through the standard software, tools, and developer experience used by customers today. That means product designers can add faster data transfer without starting over on a new stack, new tools, or with a new supplier.  

A step up in Bluetooth LE capability

Bluetooth HDT is expected to be released in late 2026 by the Bluetooth Special Interest Group (SIG). It will introduce new ways for the radio to pack more data into each transmission, along with support for longer packets enabling higher bandwidth Bluetooth data transfer.  

The company will show the technology at electronica 2026 in Munich, at booth C6 159. 

Product designers wishing to explore Bluetooth HDT with Nordic can learn more and register their interest at nordicsemi.com/BluetoothHDT.