Mobiveil Announces 25xN RapidIO Specification 4.1 (25G) Digital Controller IP for Next-Generation Wireless Networking, High-Performance Computing Applications
Latest RapidIO Controller IP Specification Improves Performance by 2.5X Over RapidIO 10xN (3.1)
MILPITAS, CALIF. –– October 11, 2017 –– Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (IP), platforms and IP-enabled design services, today announced availability of its digital controller IP compliant with the 25xN RapidIO® Specification 4.1.
This IP is targeted to both traditional RapidIO markets including wireless networking, high-performance computing (HPC) and high-reliability aerospace applications, as well as some emerging applications such as autonomous driving and cloud compute and storage.
The IP is currently targeted to ASIC market, with an FPGA version available next year. It is part of Mobiveil’s High Speed Serial Interconnect family of IP solutions that includes Gen4 PCI Express, NVM Express 1.3, DDR4/3, HBM2, ONFI, 10G/1G Ethernet MACs, PCI Express Bridge and Switch solutions. Mobiveil IP offers highly configurable, feature-rich, power-efficient and silicon-proven solutions with optimum balance between power and performance.
“The user community is pushing for higher throughput and RapidIO’s fourth-generation standard makes available 100G per port for 5G wireless networks applications,” remarks Ravi Thummarukudy, Mobiveil’s chief executive officer. “We meet this need with a controller that fully optimizes link utilization, latency, reliability, power consumption and the silicon footprint.”
The 25xN RapidIO Specification 4.1 offers 100 gigabits per second (Gbps) per port to provide a proven, open standard interconnect fabric for systems requiring heterogeneous scale out and non-volatile storage. It supports interoperability with standard multiprocessing application programming interfaces (APIs), such as RDMA, MPI and MCAPI. The 25xN RapidIO Specification 4.1 adds support for high-availability and safety-critical extensions for aerospace and autonomous-driving applications.
“Mobiveil continues to be an important contributor to the RapidIO community by providing proven RapidIO-based controllers,” adds Rick O’Connor, executive director at RapidIO.org. “We consider Mobiveil to be a key component of the RapidIO ecosystem by making IP available for the latest specification enabling faster market adoption.”
Mobiveil’s RapidIO controller IP is available with a native flexible bus interface or with a scalable AXI bus interface to support direct connectivity for ease of integration in to SoC. Pricing is available upon request.
About RapidIO.org
The RapidIO unified fabric architecture, designed to be compatible with the most popular integrated host processors, communications processors, and digital signal processors, is a high-performance, packet-switched, interconnect fabric. RapidIO addresses performance critical computing needs in data center and HPC, communications infrastructure, industrial automation and military and aerospace markets offering high reliability, increased bandwidth, and low latency in an intra-system fabric. RapidIO provides chip-to-chip, board-to-board and shelf-to-shelf peer-to-peer connectivity at performance levels scaling to 100s of Gigabits per second and beyond. RapidIO.org, a non-profit corporation controlled by its members, directs the future development and drives the adoption of the RapidIO unified fabric architecture.
About Mobiveil
Mobiveil is a fast‐growing technology company that specializes in the development of Silicon Intellectual Properties (SIP), platforms and solutions for the storage, networking and IoT applications. It leverages decades of experience in delivering high‐quality, production‐proven, high-speed serial interconnect SIP cores, platforms and services to leading semiconductor and electronic product companies worldwide. For the PCI Express-based Flash Storage market, Mobiveil developed an FPGA-based SSD subsystem comprised of GPEX™, the PCI Express Controller, NVM Express Controller (UNEX™), LDPC, Universal Memory Controller (UMMC™) and a Flash Memory Controller (EFC™). Mobiveil is headquartered in Milpitas, Calif., with engineering development centers located in Chennai and Bangalore, India, and sales offices and representatives located in U.S., Europe, Israel, Japan, Taiwan and China.
|
Mobiveil Hot IP
Related News
- Mobiveil's 25xN RapidIO 4.1 compliant controller IP achives production status
- Synopsys Enables Robust Design Optimization for Next-generation High-performance Computing, Mobile and Automotive Products with IC Compiler II and RedHawk Analysis Fusion
- VeriSilicon unveils next-generation high-performance Vitality architecture GPU IP series
- Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG® DevCon 2024
- CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |