Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
October 5, 2026 -
T2M, a member of the Bluetooth Special Interest Group (Bluetooth SIG) and a global provider of semiconductor IP cores and turnkey ASIC services, has announced the availability of its partner’s Bluetooth® Low Energy 6.3 RF IP cores for licensing. Built on silicon-proven RF architectures and offered in advanced 22 nm ULL and 40 nm ULP process technologies, the portfolio enables semiconductor companies to integrate secure, power-efficient Bluetooth connectivity into next-generation SoCs.
The Bluetooth Dual mode /BLE 6.3 RF IP core is designed to address the growing complexity of connected products, including the need for precise distance measurement, extended battery life, robust performance in congested 2.4 GHz environments and reduced integration risk. Support for Bluetooth Channel Sounding enables secure, high-accuracy ranging for automotive digital keys, smart access, asset tracking, indoor positioning, industrial automation and personal item-finding applications. Its silicon-proven architecture helps semiconductor companies extend battery life, improve positioning accuracy and accelerate the development of differentiated Bluetooth-enabled products.
T2M’s roadmap extends toward Bluetooth High Data Throughput technology, addressing emerging requirements for lossless and multichannel audio, low-latency gaming, wireless microphones, faster data transfer and accelerated over-the-air updates. The RF IP core can integrate with compatible modem, controller, and software components to support scalable Bluetooth subsystem development.
By providing access to production-proven 22nm ULL and 40nm ULP IP Cores implementations, process-node flexibility, and engineering support from architecture definition and SoC integration through production bring-up, T2M helps customers reduce development risk, shorten design cycles, and accelerate the delivery of differentiated wireless products.
Meet T2M at GTS Europe, Munich & ICCAD Expo, Beijing
T2M will attend GlobalFoundries Technology Summit Europe on 15 October 2026 in Munich and ICCAD Expo on 19–20 November 2026 in Beijing. Meet our team to explore silicon-proven Bluetooth® 6.3 RF IP Cores available for licensing. Please send meeting requests to contact@t-2-m.com.
About Us: T2M provides a broad portfolio of semiconductor IP Cores, including Wireless & Cellular/Satcom RF IP Cores. BT/BLE RF IP, Wi-Fi 6 & 7 RF IP, UWB RF, 5G, NB-IoT, GNSS, SDR & NTN. Interface IPs (USB, PCIe, DDR, MIPI, HDMI), programmable SerDes are available in major Fabs in process geometries, along with ASIC services.