NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development
Las Vegas, 10th Jan 2018 – Incise Infotech, a major Indian Semiconductor technology service provider, has signed a commercial marketing agreement with T2M, the world’s largest independent global semiconductor technology provider. Under the terms of the agreement, T2M will act as a global business development partner for Incise Infotech’s semiconductor solutions and services.
Incise has delivered first-time right and cost-effective silicon solutions to world-leading MNCs. Incise has built up a broad portfolio of semiconductor services including:
- IP/SoC Design & Verification: Verilog, VHDL, System Verilog, C based Verification, RTL Design/Integration , FPGA
- IP and VIP Design: Verilog, VHDL, UVM, OVM
- Physical Design: STA, Synthesis, DFT, PnR, DRC, LVS, LEC
- Custom Design: Custom Memory / Standard cell / Analog layout, Circuit Design and Characterization
- Virtual Prototyping: SystemC/TLM 2.0, C, C++
- Embedded Systems: Bluetooth Low Energy, IoT, Product Validation & Testing
Incise Infotech’s engineering team has extensive experience working on 130nm to 10nm technologies, FinFET, FDSOI to transform customer ideas into working silicon.
Incise VP, Rakesh Adhikari, said, “We see great potential in this partnership, Incise’s expert engineering teams will provide top quality services to T2M customers world-wide in design, verification, implementation, characterization, silicon validation and embedded software domains. Incise will dedicate a team of 100+ expert engineers to serve the needs of T2M customers.”
T2M has an extensive portfolio of semiconductor IP (intellectual property), software and SoC white box IP which it supplies to integrated device manufacturers and original equipment manufacturers globally. Nigel Dixon, CEO of T2M, said “We are very excited to drive Incise Infotech’s global business development. Our global presence provides Incise immediate exposure to all Semiconductor IDMs and OEMs. In addition, T2M’s executives have extensive market, strategic and technical knowledge in marketing semiconductor solutions to the high tech industry, enabling us to immediately and intelligently engage customers for Incise’s services”.
About Incise
Incise Infotech Pvt Ltd is a major Semiconductor Services technology company having development offices in Noida, India. It is dealing in the Semiconductor and IT domain to provide the first time right Silicon and software solutions to Indian and International clients. Incise engineers have delivered first time right Silicon for Set-Top Box, Bluetooth Low Energy Microcontroller, Hearing aid Micro-controller etc. The UFS 2.0 VIP is the latest semiconductor IP which Incise has developed for the US MNC. You can learn more about Incise Infotech Pvt. Ltd. at www.incise.in
About T2M
T2M is the world's largest independent global semiconductor technology provider, supplying complex IP, software, KGD and disruptive technologies enabling accelerated production of IoT, wireless, consumer and automotive electronics devices. Located in all key tech clusters around the world, our senior management team provides local access to leadership companies and technology. For more information, please visit www.t-2-m.com
|
T2M Hot IP
GNSS Ultra low power (GPS, Galileo, GLONASS, Beidou3, QZSS, IRNSS, SBAS) Digital ...
USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP, Silicon Proven in TSMC 28HPC+
DVB-S2X WideBand Demodulator & Decoder IP (Silicon Proven)
MIPI D-PHY Tx IP, Silicon Proven in TSMC 22ULP
Wi-Fi 802.11 ax/Wi-Fi 6 /Bluetooth LE v5.4/15.4-2.4GHz RF Transceiver IP for IOT ...
Related News
- Lekha Wireless appoints T2M for global marketing, representation and business development
- Neural computing technology leader BrainChip appoints T2M for global marketing, representation and business development
- Phison appoints T2M-IP for global marketing, representation, and business development
- 1st Silicon Selects Vice President, Marketing and Business Development to Expand Global Strategy
- Jayson Bethurem Joins Flex Logix as VP Marketing & Business Development
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |