Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
November 10, 2026 -
Tri-band Wi-Fi 7 and Bluetooth connectivity in TSMC 22nm supports semiconductor companies developing AI-enabled devices, XR platforms and consumer electronics
T2M, a global independent supplier of semiconductor IP cores, Known Good Die (KGD) and turnkey ASIC services, announces the availability of its partner’s Wi-Fi 7 RF Transceiver IP cores in TSMC 22nm technology. The IP helps semiconductor companies accelerate SoC development for AI-enabled devices, XR platforms and wireless networking products.
From XR headsets and gaming systems to intelligent cameras and home gateways, products increasingly need both high-speed Wi-Fi and Bluetooth connectivity. Meeting these requirements in a single SoC places additional demand on RF design, integration, and engineering resources.
T2M’s combo RF offering helps chip developers address both wireless requirements within their SoC architecture. By licensing the RF IP cores, customers can focus more of their engineering effort on the processing, software and application features that distinguish their products.
The Wi-Fi 7 RF supports the 2.4 GHz, 5 GHz and 6 GHz bands, with channel bandwidths up to 160 MHz. The Bluetooth RF supports Channel Sounding and High Data Throughput (HDT), addressing demand for accurate distance measurement and higher-rate Bluetooth data links alongside established connectivity requirements.
Proven RF Technology, Greater Design Flexibility
For semiconductor companies, silicon-proven IP cores provide a stronger starting point for assessing RF performance and planning integration. Customers can align the RF offering with their selected Wi-Fi baseband, Bluetooth controller and software architecture.
An integrated power amplifier and support for external RF front-end modules provide additional flexibility to meet different system requirements.
Key customer benefits include:
The IP cores target connected consumer electronics, XR and gaming platforms, smart cameras, gateways and other products requiring both Wi-Fi and Bluetooth connectivity.
The Wi-Fi 7 and Bluetooth Combo RF IP cores are available for licensing in TSMC 22nm. T2M works with customers to assess technical fit, integration requirements and project scope. Porting to other process technologies can be evaluated on request.
Meet T2M at Electronica and ICCAD
T2M will be attending Electronica in Munich and ICCAD in Beijing. The team welcomes the opportunity to meet semiconductor companies in person to discuss upcoming SoC requirements and the Wi-Fi 7 and Bluetooth Combo RF IP cores in greater detail. For more information on licensing options and pricing, please drop a request: contact@t-2-m.com
T2M Introduces Wi-Fi 7 and Bluetooth Combo RF IP Cores to Accelerate Development of Connected AI and XR SoCs
Tri-band Wi-Fi 7 and Bluetooth connectivity in TSMC 22nm supports semiconductor companies developing AI-enabled devices, XR platforms and consumer electronics
T2M, a global independent supplier of semiconductor IP cores, Known Good Die (KGD) and turnkey ASIC services, announces the availability of its partner’s Wi-Fi 7 RF Transceiver IP cores in TSMC 22nm technology. The IP helps semiconductor companies accelerate SoC development for AI-enabled devices, XR platforms and wireless networking products.
From XR headsets and gaming systems to intelligent cameras and home gateways, products increasingly need both high-speed Wi-Fi and Bluetooth connectivity. Meeting these requirements in a single SoC places additional demand on RF design, integration, and engineering resources.
T2M’s combo RF offering helps chip developers address both wireless requirements within their SoC architecture. By licensing the RF IP cores, customers can focus more of their engineering effort on the processing, software and application features that distinguish their products.
The Wi-Fi 7 RF supports the 2.4 GHz, 5 GHz and 6 GHz bands, with channel bandwidths up to 160 MHz. The Bluetooth RF supports Channel Sounding and High Data Throughput (HDT), addressing demand for accurate distance measurement and higher-rate Bluetooth data links alongside established connectivity requirements.
Proven RF Technology, Greater Design Flexibility
For semiconductor companies, silicon-proven IP cores provide a stronger starting point for assessing RF performance and planning integration. Customers can align the RF offering with their selected Wi-Fi baseband, Bluetooth controller and software architecture.
An integrated power amplifier and support for external RF front-end modules provide additional flexibility to meet different system requirements.
Key customer benefits include:
The IP cores target connected consumer electronics, XR and gaming platforms, smart cameras, gateways and other products requiring both Wi-Fi and Bluetooth connectivity.
The Wi-Fi 7 and Bluetooth Combo RF IP cores are available for licensing in TSMC 22nm. T2M works with customers to assess technical fit, integration requirements and project scope. Porting to other process technologies can be evaluated on request.
Meet T2M at Electronica and ICCAD
T2M will be attending Electronica in Munich and ICCAD in Beijing. The team welcomes the opportunity to meet semiconductor companies in person to discuss upcoming SoC requirements and the Wi-Fi 7 and Bluetooth Combo RF IP cores in greater detail. For more information on licensing options and pricing, please drop a request: contact@t-2-m.com