PathPartner to Showcase Innovations in Face Recognition and Automotive Vision at TU-Automotive, Detroit 2018
These innovations coupled with PathPartner’s technology service offerings enable automotive OEMs and suppliers to embed intelligent technologies in a cost efficient, flexible and accelerated manner.
FREMONT, Calif. -- June 4, 2018 -- PathPartner Technology, a product R&D and engineering specialist, today announced that it will demonstrate its latest innovations in facial recognition and analysis, and automotive vision at booth A-42 in TU-Automotive that will be held on June 6-7, 2018 at Detroit. These innovations coupled with PathPartner’s technology service offerings enable automotive OEMs and suppliers to embed intelligent technologies in a cost efficient, flexible and accelerated manner.
PathPartner’s demonstrations at TU-Automotive 2018 include:
- A low complexity yet robust CNN architecture based face recognition system, suitable for first generation processors with CNN support
- Advanced facial landmark detection and tracking algorithms that form building blocks for solutions such as driver drowsiness detection, audience classification in retail and eye gaze tracking in gaming/AR/VR
- Automotive vision solutions such as traffic sign recognition, vehicle detetcion and pedestrian detection on leading automotive grade SoCs and vision processors
Ramkishor Korada, Co-Founder & EVP at PathPartner said, “We have been providing design services to automotive OEMs, tier-1s and semiconductor companies for a decade now. Our extensive experience in vision algorithms, processor architectures, multimedia systems and system level performance tuning, enables us to offer differentiating services and products to our customers.”
To experience these innovations, visit PathPartner at Booth A42 in TU-Automotive that will be held on June 6-7, 2018 at Detroit. To setup a meeting or an online demonstration, write to marcom(at)pathpartnertech.com
About PathPartner Technology
PathPartner is product R&D and engineering specialist. We help our clients develop, productize, and maintain advanced technology products. With our full stack engineering services, re-usable solution accelerators, and an unparalleled experience in transforming innovative ideas into full-fledged products, PathPartner provides its clients the advantage of top-of-the-line technologies, superior performance and faster time-to-market. With extensive expertise in embedded systems, computer vision, deep learning, multimedia and imaging technologies, PathPartner provides next-gen technology solutions to customers in automotive, internet of things, intelligent devices and digital media products domain.
PathPartner’s catalog of products and services continues to expand. To know more details and collaborate on next-gen products, please visit http://www.pathpartnertech.com or write to us at marcom(at)pathpartnertech.com
|
Related News
- PathPartner to showcase a spectrum of innovations in Automotive ADAS and Internet of Things at Electronica 2018
- Videantis and VISCODA partner to showcase key automotive ADAS technology in Detroit
- Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications
- Andes and Vector Propel RISC-V AUTOSAR Software Innovations for the Automotive Industry
- Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |