PathPartner to Showcase Innovations in Face Recognition and Automotive Vision at TU-Automotive, Detroit 2018
These innovations coupled with PathPartner’s technology service offerings enable automotive OEMs and suppliers to embed intelligent technologies in a cost efficient, flexible and accelerated manner.
FREMONT, Calif. -- June 4, 2018 -- PathPartner Technology, a product R&D and engineering specialist, today announced that it will demonstrate its latest innovations in facial recognition and analysis, and automotive vision at booth A-42 in TU-Automotive that will be held on June 6-7, 2018 at Detroit. These innovations coupled with PathPartner’s technology service offerings enable automotive OEMs and suppliers to embed intelligent technologies in a cost efficient, flexible and accelerated manner.
PathPartner’s demonstrations at TU-Automotive 2018 include:
- A low complexity yet robust CNN architecture based face recognition system, suitable for first generation processors with CNN support
- Advanced facial landmark detection and tracking algorithms that form building blocks for solutions such as driver drowsiness detection, audience classification in retail and eye gaze tracking in gaming/AR/VR
- Automotive vision solutions such as traffic sign recognition, vehicle detetcion and pedestrian detection on leading automotive grade SoCs and vision processors
Ramkishor Korada, Co-Founder & EVP at PathPartner said, “We have been providing design services to automotive OEMs, tier-1s and semiconductor companies for a decade now. Our extensive experience in vision algorithms, processor architectures, multimedia systems and system level performance tuning, enables us to offer differentiating services and products to our customers.”
To experience these innovations, visit PathPartner at Booth A42 in TU-Automotive that will be held on June 6-7, 2018 at Detroit. To setup a meeting or an online demonstration, write to marcom(at)pathpartnertech.com
About PathPartner Technology
PathPartner is product R&D and engineering specialist. We help our clients develop, productize, and maintain advanced technology products. With our full stack engineering services, re-usable solution accelerators, and an unparalleled experience in transforming innovative ideas into full-fledged products, PathPartner provides its clients the advantage of top-of-the-line technologies, superior performance and faster time-to-market. With extensive expertise in embedded systems, computer vision, deep learning, multimedia and imaging technologies, PathPartner provides next-gen technology solutions to customers in automotive, internet of things, intelligent devices and digital media products domain.
PathPartner’s catalog of products and services continues to expand. To know more details and collaborate on next-gen products, please visit http://www.pathpartnertech.com or write to us at marcom(at)pathpartnertech.com
|
Related News
- PathPartner to showcase a spectrum of innovations in Automotive ADAS and Internet of Things at Electronica 2018
- Videantis and VISCODA partner to showcase key automotive ADAS technology in Detroit
- Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |