RT-640 Programmable Root-of-Trust Security Processor for Automotive ASIL-B-ready
Huawei is hurrying to build a wafer fab
By Peter Clarke, eeNews Analog
August 24, 2020
Communications giant Huawei Technologies Co. Ltd. is hurrying to build a wafer fab capable of running 45nm CMOS manufacturing process, according to unsubstantiated Chinese social network reports.
Huawei is the largest communications equipment company in the world and a pioneer of 5G, but also a central actor in worsening trade tension between the US and China. The crippling embargo denying chips to Huawei, imposed and tightened by the US in 2020 (see US government reinforces Huawei chip embargo ), is causing Huawei smartphone and equipment businesses to stall for lack of chips.
Previously the company's semiconductor subsidiary HiSilicon designed the chips and used foundry Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) to get them made. The US is saying both design and manufacture depend on US technology and are not allowed without a special license.
To try and circumvent embargo Huawei has finalized plans to establish a wafer fab with the first production line due to be finalized by the end of 2020. The plan is codenamed "Project Tashan" meaning courage, daring or attitude, depending on your dictionary.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
Breaking News
- eInfochips Wins Design Services Company of the Year Award from IESA
- Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
- Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
- Arasan announces its Total eMMC IP solution for TSMC 22nm process
- MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
Most Popular
- Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
- Arasan announces its Total eMMC IP solution for TSMC 22nm process
- Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
- Industry R&D Spending To Rise 4% After Hitting Record in 2020
- Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC