NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Shift from 8'' Wafer Fabs to 12'' Could Ease IC Shortages
By Ian Lankshear, EnSilica (May 18, 2021)
To put it mildly, the 8-inch (200mm) wafer supply chain is somewhat struggling.
As one headline from December read, “8-inch wafer capacity is in short supply to unimaginable levels”, with the article stating “wafer production capacity is so tight that customers’ demand for production capacity has reached a panic level.” And that from mid 2021 “to the second half of 2022, the logic and DRAM markets will be out of stock.”
This is not a new problem, Trends Force stated around the same time that “8-inch wafer capacity has been in severe shortage since 2H19”. And EE Times reported in February 2020 that “Shortages loom after 8-inch fabs run at 99% capacity in Q1”.
And to cap it all off, March’s fire at a Renesas fab used by GM and other car manufacturers can only make matters worse. As Nikkei put it: “Loss of advanced semiconductors could worsen global crunch [of automotive chips].”
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
EnSilica Ltd. Hot IP
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation