TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
Hsinchu, Taiwan, R.O.C., - July 26, 2021 – TSMC (TWSE: 2330; NYSE: TSM) today held its 2021 Annual Shareholders’ Meeting, which passed the following major resolutions:
1. Acknowledged the 2020 Business Report and Financial Statements. Consolidated revenue totaled NT$1,339.255 billion and net income was NT$517.89 billion, with diluted earnings per share of NT$19.97.
2. Approved the issuance of employee restricted stock awards (RSAs) for the year 2021.
3. Elected TSMC’s 15th Board of Directors. The 10 Directors are: Mark Liu, C.C. Wei, F.C. Tseng, Ming-Hsin Kung (Representative of the National Development Fund, Executive Yuan), Sir Peter Leahy Bonfield, Kok-Choo Chen, Michael R. Splinter, Moshe N. Gavrielov, Yancey Hai, and L. Rafael Reif. Six of those elected, Sir Peter Leahy Bonfield, Kok-Choo Chen, Michael R. Splinter, Moshe N. Gavrielov, Yancey Hai, and L. Rafael Reif are independent directors (in chronological order of time they joined the Board).
After the Annual Shareholders’ Meeting, TSMC also held the first meeting of the 15th Board of Directors, at which the Board unanimously re-elected Dr. Mark Liu as Chairman and Dr. C.C. Wei as Chief Executive Officer (CEO) and Vice Chairman.
|
Related News
- TSMC Shareholders Approve NT$8 Cash Dividend and Elect Board of Directors; Board of Directors Elect Mark Liu as Chairman and C.C. Wei as CEO and Vice Chairman
- TSMC Dr. Morris Chang Announces Retirement in June 2018. Future Dual Leadership Will Be Mark Liu as Chairman And C.C. Wei as CEO.
- TSMC Board of Directors Resolution
- TSMC Announces Dr. Mark Liu Not to Participate in Next Board of Directors Election
- TSMC Special Board of Directors Meeting Resolutions
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |