Micron and UMC Announce Global Settlement
November 26, 2021 -- United Microelectronics Corporation (TWSE: 2303; NYSE: UMC) and Micron Technology, Inc. (Nasdaq: MU) today announced a settlement agreement between the two companies worldwide. The companies will globally withdraw their complaints against the other party, and UMC will make a one-time payment of an undisclosed amount to Micron. UMC and Micron look forward to engaging in mutual business cooperation opportunities.
Micron is one of the world’s largest semiconductor companies with more than 40 years of technology leadership and innovation, over 47,000 lifetime patents granted and significant investment in leading edge manufacturing and processes. IP protection is fundamental to Micron’s ability to remain competitive as the company continues to drive innovation that is essential to the data economy.
UMC is a leading global semiconductor foundry company focusing on the fabrication of logic and specialty products for all major sectors of the electronics industry. UMC has 12 fabs with combined capacity close to 800,000 wafers per month (8-in equivalent). UMC continuously implements and refines its policy and procedures for trade secret protection while providing high quality products and services to its customers.
|
Related News
- Taiwan's Intellectual Property and Commercial Court Announced Its Ruling on UMC and Other Defendants with Respect to Micron Case
- UMC Files Patent Infringement Lawsuit against Micron
- Semiconductor Sales Recover in 2013; Micron Surges to Fourth Place in Global Chip Market
- Global Semiconductor Sales Up Slightly in September
- Qimonda Announces Global Restructuring Program and Agrees to Sell Its Stake in Inotera Memories to Micron Technology
Breaking News
- Silicon industry veteran Oreste Donzella joins Sondrel board as Non-Executive Director
- Powering the NVM and Embedded Chip Security Technologies
- BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC
- BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform
- Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip
Most Popular
- MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
- Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
- Quobly announces key milestone for fault-tolerant quantum computing
- Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
- Alphawave IP - Announcement regarding leadership transition
E-mail This Article | Printer-Friendly Page |