Global 200mm Semiconductor Fab Capacity Projected to Surge 20% to Record High by 2025, SEMI Reports
MILPITAS, Calif. — October 18, 2022 — Semiconductor manufacturers worldwide are estimated to increase 200mm fab capacity 20% from 2021 through 2025, adding 13 new 200mm lines as the industry reaches a record high of more than 7 million wafers per month (wpm), SEMI announced today in its 200mm Fab Outlook to 2025 report. Surging demand for automotive and other applications are driving the capacity expansion for power semiconductors and MEMS.
Chipmakers including ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics have announced new 200mm fabs to meet growing demand.
The SEMI 200mm Fab Outlook to 2025 report shows fab capacity for automotive and power semiconductors growing at a rate of 58% from 2021 to 2025, followed by MEMS at 21%, foundry at 20% and analog at 14%.
Regional Outlooks
China will lead the world in 200mm capacity expansions with a 66% increase by 2025, followed by Southeast Asia at 35%, Americas at 11%, Europe and Mideast at 8%, and Korea at 2%. In 2022, China is expected to claim 21% share of global 200mm fab capacity, followed by Taiwan and Japan at 11% and 10%, respectively.
The SEMI 200mm Fab Outlook to 2025 report tracks more than 330 fabs and lines. The report reflects 75 updates across 53 facilities and lines and includes four new projects since the previous report in April 2022.
About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org.
|
Related News
- Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports
- Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports
- Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
- 200mm Semiconductor Fab Capacity Set to Surge 21% to Mitigate Supply-Demand Imbalance, SEMI Reports
- Second Quarter 2021 Global Semiconductor Equipment Billings Surge 48% Year-Over-Year to Record High of $24 Billion, SEMI Reports
Breaking News
- NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Premier ASIC and SoC Design Partner Rebrands as Aion Silicon
- Baya Systems, Imagination Technologies and Andes Technology to Present on Heterogeneous Compute Architectures at Andes RISC-V CON Silicon Valley
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
Most Popular
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- BrainChip Extends RISC-V Reach with Andes Technology Integration
- Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |