Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
SAN JOSE, California – Oct 9, 2023 – Omni Design Technologies, a leading provider of low-power, high-performance mixed-signal Intellectual Property (IP) solutions, announced that it will present “Next Generation LiDAR Solutions: Unleashing the Power of High-Performance Low Power Data Converters” at CadenceLIVE Europe 2023 on October 10 & 11 in Munich, Germany.
This presentation, delivered jointly with Cadence, will focus on the adoption of LiDAR in the automotive driver assistance (ADAS) market and the role of high-performance, low-power data converters in next-generation LiDAR systems. The presentation is based on the ongoing collaboration between Omni Design and Cadence on a solution combining DSP IP with data converters for deployment in the automotive market.
About Omni Design Technologies
Omni Design Technologies is the leading provider of high-performance, ultra-low power mixed signal IP cores in advanced process technologies that enable highly differentiated systems-on-chip (SoCs) in applications ranging from wired and wireless communications, automotive, imaging, sensors, and IoT. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas (California), with additional offices in Fort Collins (Colorado), Billerica (Massachusetts), Bangalore (India), Hyderabad (India), and Ireland. For more information, visit www.omnidesigntech.com.
|
Related News
- Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters
- Omni Design Announces Availability of LiDAR Receiver Subsystem
- Omni Design and LeddarTech Collaborate to Accelerate Mass Market Deployment of LiDAR for ADAS and Autonomous Vehicles
- GUC and Omni Design Tape Out 16nm LiDAR SoC
- Frontgrade Gaisler Leads European Initiative for Ultra Deep Sub-Micron Semiconductor Technology for Space Applications
Breaking News
- SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips
- BrainChip Brings Neuromorphic Capabilities to M.2 Form Factor
- Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms
- TSMC December 2024 Revenue Report
- NASA Awards Alphacore Four Contracts for Radiation Hardened Microelectronics Innovation
Most Popular
- Imagination pulls out of RISC-V CPUs
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- BrainChip Brings Neuromorphic Capabilities to M.2 Form Factor
- RISC-V in AI and HPC Part 1: Per Aspera Ad Astra?
- Synopsys Responds to the European Commission Approving its Proposed Acquisition of Ansys in Phase 1
E-mail This Article | Printer-Friendly Page |