Intel to place US$14 billion orders with TSMC, says report
By Peter Clarke, eeNews Europe (November 27, 2023)
Over the next two years Intel will place orders worth US$14 billion with foundry TSMC according to Taiwan-based semiconductor analyst Andrew Lu, reported on China’s WeChat platform.
Lu reportedly issued a note to clients saying that Intel will order US$4 billion of 3nm chips for its Lunar Lake personal computer processor from TSMC in 2024. This will be followed by orders worth US$10 billion in 2025.
The development will likely make Intel TSMC’s second largest customer for 3nm chips in 2025, behind Apple and ahead of AMD, the report said.
E-mail This Article | Printer-Friendly Page |
Related News
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023, Says TrendForce
- Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce
- 3Q21 Revenue of Global Top 10 IC Design (Fabless) Companies Reach US$33.7 billion, Four Taiwanese Companies Make List, Says TrendForce
- Revenue of Top 10 IC Design (Fabless) Companies Reaches US$29.8 Billion for 2Q21, Though Growth May Potentially Slow in 2H21, Says TrendForce
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X